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Basic Information

Reference Number

0000032318

Issuing Organization

City of Louisville

Owner Organization

Public Works

Solicitation Type

ITB - Invitation to Bid (Formal)

Solicitation Number

IFB Hot Chip Seal Project

Title

2016 Hot Chip Seal Project

Source ID

PU.AG.USA.2049

Details

Location

United States, Colorado

Delivery Point

Louisville, CO

Purchase Type

One Time Only- Delivery Date:Summer 2016

Piggyback Contract

Description

Summary of Specifications:
The Work for which the Bid is requested consists of demolition, asphalt paving, milling, patching, leveling, hot chip seal, pavement marking and traffic control including all work appurtenant thereto, on various streets within the City of Louisville, Colorado.

Dates

Publication

12/04/2015 05:24 PM EST

Question Acceptance Deadline

12/15/2015 05:00 PM EST

Questions are submitted online

Closing Date

12/22/2015 01:00 PM EST

Prebid Conference

12/08/2015 01:00 PM EST

Contact Information

Kerry Holle

303-335-4608

kerryh@louisvilleco.gov

Additional Information

Contact 1 for questions

Ms. Joliette Woodson, Project Manager, joliettew@louisvilleco.gov

Other

Accepting Vendor Questions

Buyer Preferences, Guidelines & Requirements

General Requirements

- Bidder Prequalification/Preregistration Required

- Contractors License Required

- Insurance Required

Award Requirements

- All or None Award

Bonding Requirements

- Bid Bond

Yes

- Labor and Materials Bond

Yes

- Performance Bond

Yes

Pre-Bidding Events

Event Type

Prebid Conference

Attendance

Mandatory

Event date

12/08/2015 01:00 PM EST

Location

Louisville City Hall

Event Note
See more

Bid Submission Process

Bid Submission Type

Physical Bid Submission