Required Services. 1.1. Modification of Wafer Transfer Chamber. Successful Proposer would be required to: 1.1.1. Mechanically integrate University’s wafer transfer chamber with chamber 1 via continuous vacuum space. 1.1.2. Design and fabricate an adapter plate to align the two chambers. 1.1.3. Modify both the original deposition chamber (“MBE”) and the wafer robot systems to accommodate the new alignment. The design must ensure ease of disassembly for repairs and cleaning. 1.2. Multi-Turbo Pump Control System. Successful Proposer would be required to: 1.2.1. Develop and implement a control system for the multi-turbo pumps, cryopumps and associated interlocks. 1.2.2. Rework the roughing pump plumbing to accommodate the complex geometry of the robot wafer handler, ensuring it connects to the roughing pump located beneath the robot. 1.2.3. Install individual isolation valves for each turbo pump. Reverse engineer vacuum sensors to deliver transistor to transistor logic (“TTL”) signals to the main system controller..
