Specifications include, but are not limited to: This bid request is for the replacement of a tool used in the Nanoscale Fabrication Center (NFC) within the College of Engineering. The Inductively Coupled Plasma Metal Etcher being requested will be used for the etching of metal, III-V materials, etc. Minimum Requirements; System: 1. System shall be an established model with at least 20 units in use in industry and/or academia. 2. System shall be manufactured in a facility with ISO 9001 certification. 3. System shall meet NFPA 70 National Electrical Code Article 110 “Requirements for Electrical Installations”. 4. The system shall be 208 V 60Hz 3phase. 5. The system shall be equipped with the process control module for chlorine and bromine type chemistries. 6. The system shall support up to 150mm SEMI standard wafers and accept smaller wafers and pieces with interchangeable electrode clamps or supplied 6-inch carrier fixture for smaller wafers. 7. The system shall come with a hard copy of all mechanical and electrical drawings for the system and components. ICP Source: 1. The process module shall have ICP plasma. 2. ICP source shall be operational from 0 to 1000W or higher with power repeatability to +/- 2% and utilize automatic matching unit. 3. ICP source shall be of sufficient diameter to satisfy the process uniformity +/- 5% or better over 150 mm in diameter semi standard wafer.
