University seeks to procure two or three turnkey, direct-write lithography tools. These tools will be used as part of the semiconductor program of the Knight Campus Graduate Internship Program that has placed hundreds of masters students into processing engineering positions in the semiconductor industry. The direct write tools must meet the following required specifications (Those items marked “preferred” are not required in order to submit a proposal, but are preferred by University): 2.1. Substrates up to 100 mm x 100 mm and thickness from 0.25 – 10 mm. 2.2. Accommodation of both positive and negative photoresists in the 365-405 nm exposure wavelength range. 2.3. Ability to write on nearly entire surface (specify edge exclusion if any) of a 10 mm x 10 mm substrate and be tolerant of variation in photoresist thickness across surface. 2.4. Five micron resolution or better. 2.5. Fast write time. Faithfully pattern provided dxf file “MetallizationPatternScale1.dxf” into 1.5 micron thick AZ1512 photoresist (or similar) on silicon with 5 micron or better resolution in less than 10 minutes (faster strongly preferred). 2.6. Suitable for operation in environments with 0.3 micron or greater particle counts of up to 100,000 / ft3 without instrument damage. 2.7. Manual and automatic topside alignment with better than 2 micron accuracy. Specify if any minimum sample size for automatic alignment (10 mm x 10 mm or smaller strongly preferred). 2.8. Software for control of lithography functions and capturing images and that accepts common file formats such as DXF, CIF and/or GDSII. 2.9. Smallest in-lab footprint for above features. 2.10. (Preferred. Quote as option if available and not included.) Tools for pattern creation and editing integrated into software and available for use on an independent computer. 2.11. (Preferred. Quote as option if available and not included.) Ability in the same instrument to switch writing resolution to enable both fast writing near 5 micron resolution and higher resolutions at lower speeds. 2.12. (Preferred. Quote as option) Table to house all system components, provide vibration damping, and minimize system footprint.
