University seeks to procure one or two turnkey, manual mask aligners to support the University’s semiconductor device processing needs (primarily instructional). These tools will be used as part of the semiconductor program of the Knight Campus Graduate Internship Program. Each manual mask aligner must meet the following required specifications (those items marked preferred are not required in order to submit a proposal, but are preferred by University): 2.1. General 2.1.1. Manual mask aligner for alignment of a photoresist coated substrate with a patterned mask (typically metal on glass) to transfer the pattern to the wafer using light exposure through the mask. 2.1.2. Smallest footprint ideally for benchtop operation. 2.1.3. Capable of submicron patterning (indicate feature size/resolution obtainable including supporting images of aligner performance). 2.1.4. Suitable for operation in environments with 0.5 micron or greater particle counts of up to 100,000 / ft3 without instrument damage. 2.2. Mask and Substrate 2.2.1. Substrates with sizes from 10 mm x 10 mm up to ⌀4” wafer and with thickness up to 4mm (specify substrate holder most compatible with 10 mm x 10 mm and others as options). 2.2.2. Accommodates masks from 2” x 2” to at least 5” x 5” 2.2.3. Easily exchangeable chucks. 2.2.4. Substrate loading without needing to remove mask/mask holder. 2.3. Alignment and contacting 2.3.1. Top side alignment 2.3.2. Alignment accuracy +/- 0.5 microns 2.3.3. Travel range of alignment stage at least 5 mm in x and y and 5o in φ. 2.3.4. Microscope with video system suitable for alignment on 10 mm x 10 mm substrates being patterned with an image in the center of a 2.5 in x 2.5 in mask. (Strongly preferred and quote as option if available and not standard: splitfield microscope for alignment using two alignment marks on larger samples).
