Laramie County Community College’s Advanced Manufacturing & Material Center (AMMC) invites vendors to provide bid responses for the purchase of one (1) Artec Leo 3D Scanner to be delivered and installed at the Career & Technical (CT) training facility located in Cheyenne, WY. Specifications listed below. No Substitutions. Qty 1 Artec Leo 3D Scanner Working distance 0.35 – 1.2 m Volume capture zone 160,000 cm3 Linear field of view (H × W @ closest range)244 × 142 mm Linear field of view (H × W @ furthest range)838 × 488 mm Angular field of view (H × W) 38.5 × 23° 3D resolution up to 0.2 mm 3D point accuracy up to 0.1 mm 3D accuracy over distance up to 0.1 mm + 0.3 mm/m Texture resolution 2.3 mp HD Mode Yes Colors 24 bpp 3D reconstruction rate for real-time fusion up to 22 fps 3D reconstruction rate for 3D video recording up to 44 fps 3D reconstruction rate for 3D video streaming up to 80 fps Data acquisition speed up to 35 mln points/s 3D exposure time 0.0002 s 2D exposure time 0.0002 s 3D light source VCSEL Flash bulb Blue LED 2D light source White 12 LED array Position sensors Built-in 9 DoF inertial system Display / touchscreen Integrated 5.5" half HD, CTP, optional Wi-Fi / Ethernet video streaming to external device Multi core processingEmbedded processors: NVIDIA® Jetson™ TX1 Quad-core ARM® Cortex®-A57 MPCore Processor NVIDIA Maxwell™ 1 TFLOPS GPU with 256 NVIDIA® CUDA® Cores Interface Wi-Fi, Ethernet, SD card Internal hard drive 256 GB SSD 3D mesh formats OBJ, PLY, WRL, STL, AOP, ASC, Disney PTX (PTEX), E57, XYZRGB CAD formats STEP, IGES, X_T Formats for measurements CSV, DXF, XML Power source Built-in exchangeable battery, optional AC power 20 seats of Artec Studio Software LCCC is tax-exempt. LCCC prefers local installation of equipment and will consider as part of their evaluation. Bid response must be submitted by October 7, 2024 by 2:00 p.m. MT via Public Purchase Online Bidding System ONLY. **All bid responses must include the completed and signed BID SUBMITTAL & PRICING DOCUMENT found in the RFB documentation**
