PROJECT: CITY OF HILLSDALE 2019 CHIP SEAL & FOG STREET PRESERVATION PROJECT
OWNER: CITY OF HILLSDALE, MICHIGAN
ENGINEER: MT Engineering, LLC
PO Box 232
Hillsdale, MI 49242
517-437-4283
Engr: Matt. Taylor, P.E.
SEALED BID DUE DATE: Monday, May 6, 2019
Location: City Clerk’s Office
1:30 p.m., local time City Hall
97 N. Broad Street
Hillsdale, MI 49242
PUBLIC OPENING DATE: Monday, May 6, 2019
Location: City Hall
1:35 p.m., local time
97 N. Broad Street
Hillsdale, MI 49242
BASIS OF PROPOSALS: Bids are solicited on a Unit Price basis. Note that there are three
alternate bids for which unit prices shall be provided:
Alternate No. 1: Provide fiber reinforcing in the chip seal
application for areas illustrated to be part of the base bid.
Alternate No. 2: Provide unit prices as solicited on the proposal
form that would be applied to additional work in order to perform
chip seal and fog in the additional areas identified on the
construction plans. This alternate is being solicited because
adding these additional areas would significantly change the
scope and nature of the Project.
Alternate No. 3: Provide fiber reinforcing in the chip seal
application for areas illustrated to be part of Alternate No. 2.
PROJECT DESCRIPTION: Contract for pavement cleaning, ship sealing, fogging, placement
of pavement markings and all incidental items related thereto to
complete the work.
BID SECURITY: Each Proposal shall be accompanied by a cashier’s check,
certified check, money order or bid bond, payable to the
OWNER, in an amount not less than five percent (5%) of the
amount of the Proposal, as a Bid Security. The Bid Security of
the Bidders under consideration will be returned after approval of
AD-2
the Contract by the OWNER. All others will be returned within
48 hours after the Proposal opening.
CONTRACT SECURITY: The successful Bidder may be required to furnish satisfactory
Performance Bond, Payment Bond and Material Bond in the
amount of One Hundred Percent (100%) of the Contract and
satisfactory insurance coverage. Bidders shall identify such
potential bond costs as indicated on the proposal form.
